Skip to main content
SLU publication database (SLUpub)

Research article2004Peer reviewed

Transport and tensile properties of compression-molded wheat gluten films

Gallstedt M, Mattozzi A, Johansson E, Hedenqvist MS

Abstract

Mechanical and transport properties were assessed on wheat gluten films with a glycerol content of 25-40%, prepared by compression molding for 5-15 min at temperatures between 90 and 130 degreesC. Effects of storing the films up to 24 days, in 0 and 50% relative humidity (RH), were assessed by tensile measurements. The films were analyzed with respect to methanol zero-concentration diffusivity, oxygen permeability (OP), water vapor permeability (WVP), Cobb(60) and sodium dodecyl sulfate (SDS) solubility coupled with sonication. The SDS solubility and methanol diffusivity were lower at the higher molding temperature. Higher glycerol content resulted in higher OP (90-95% RH), WVP, and Cobb(60) values, due to the plasticizing and hygroscopic effects. Higher glycerol contents gave a lower fracture stress, lower Young's modulus, lower fracture strain, and less strain hardening. The mold time had less effect on the mechanical properties than mold temperature and glycerol content. The fracture stress and Young's modulus increased and the fracture strain decreased with decreasing moisture content

Published in

Biomacromolecules
2004, Volume: 5, number: 5, pages: 2020-2028 Publisher: AMER CHEMICAL SOC

      SLU Authors

    • Johansson, Eva

      • Department of Crop Science, Swedish University of Agricultural Sciences

    UKÄ Subject classification

    Agricultural Science

    Publication identifier

    DOI: https://doi.org/10.1021/bm040044q

    Permanent link to this page (URI)

    https://res.slu.se/id/publ/3734